亚洲精品一区二区中文,欧美久久laowang,国产a在线不卡一区二区三区,在线观看视频一区二区三区,久久综合国产精品一区二区,久久69精品久久久久电影,亚洲99久久精品片黄绝片,久久久91麻豆精品国产一区,亚洲午夜久久久久噜噜噜,精品一区二区欧美成人精彩视频

BSI LiDAR芯片

您現在的位置:首頁 > 產品技術 > BSI LiDAR芯片

產品介紹


DX319 is a diagonal 3.0 mm (Type 1/6) 240x180 fully integrated LiDAR (Light Detection And Ranging) camera sensor which allows to address 3D applications such as gesture recognition, active controls, real world acquisition. It is specifically designed for operation in low power mobile platforms such as pc camera, tablet pc, and cellular phone. The sensor implements SPAD pixel technology. When used in combination with a pulsed IR light source, this sensor can return correlation data, from which depth and confidence images at 240 x 180 resolution can be derived. It operates with four power supply voltages: analog 2.7 V, pixel -20 V, digital 1.2 V and 1.8V for input / output interface. It contains an integrated illumination controller and can be configured and controlled through an SPI Interface. In addition, this product is designed for use in pc camera, tablet pc, and cellular phone.



關鍵特性介紹


  • 3D LiDAR technology with high sensitivity SPAD detection
  • Delivers high SNR, wide dynamic range and no multi-path reflections
  • 1/6” optical Light Detection And Ranging sensor (optical area 2.4mm x 1.8 mm)
  • 10um x 10 um BSI pixels
  • 240 x 180 SPAD Detection And Ranging pixels
  • I2C slave interface for configuration and control
  • SPI Master for peripheral configuration
  • TDC frequency up to 30GHz(5mm LSB)
  • Dynamic spot tracking
  • Fast on-chip histogram processing
  • Sub-nanosecond light pulse
  • Sunlight on-chip rejection filter and algorithm
  • Programmable Repetition rate
beian  滬公網安備31011502017181號    滬ICP備2021006116號-1
?Copyright 上海大芯半導體有限公司 All Rights Reserved